Dr Ronit Das | Metals and Alloys | Best Researcher Award
Dr. Ronit Das is a dynamic and forward-thinking materials engineer whose expertise lies in advanced microelectronics packaging, solder reliability, and interconnect technologies. With a Ph.D. in Industrial and Systems Engineering from Binghamton University (SUNY), his work bridges the gap between academic rigor and industrial application. Currently employed at Apple Inc. as an IC Package Integration Engineer, Dr. Das has previously contributed to leading tech companies like Intel, AMD, and Applied Materials. His academic and professional trajectory highlights a deep commitment to reliability science, microscale fatigue, and innovative materials for next-generation electronic systems.
Dr Ronit Das, Binghamton University, United States
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🎓 Education
Dr. Ronit Das holds a strong academic foundation in engineering and materials science. He earned his Ph.D. in Industrial and Systems Engineering from Binghamton University – SUNY (2020–2023), where his dissertation focused on Pb-free SnAgCu-Bi solder joints and their fatigue damage properties ⚙️📉. He completed his M.S. in the same field at Binghamton (2018–2019), researching intermetallic morphology and void formation in micro-joints 🔬📊. His academic journey began with a B.E. in Mechanical Engineering from the University of Mumbai (2011–2015), where he graduated with distinction 🎯📚. His education blends mechanics, reliability, and materials innovation 🧠🛠️.
🧑💼 Experience
Dr. Ronit Das brings a wealth of experience across academia and industry in advanced packaging, reliability engineering, and materials science. At Apple Inc. 🖥️📦, he drives innovative IC packaging from concept to high-volume manufacturing. Previously at Applied Materials 🧪🔬, he focused on failure analysis and PVD coatings. His doctoral research at Binghamton University 🎓🔧 involved solder joint fatigue, intermetallic evolution, and thermal reliability. With prior engineering roles in India 🌏⚙️, he also worked in product development and industrial safety. His expertise spans flip-chip, 2.5D/3D packaging, electromigration, and finite element modeling 🛠️📊, making him a well-rounded engineer and researcher.
🛠️ Technical Skills
Dr. Ronit Das possesses an exceptional technical portfolio in reliability testing 🧪, including fatigue, shear, vibration, and thermal cycling analysis 🔄. He is proficient in advanced failure analysis techniques such as SEM, EBSD, EDX, CT, and AFM 🔬🧠. His hands-on expertise includes thin-film deposition, non-destructive testing, and metallographic processing 🧱⚙️. He is skilled in simulation and data tools like MATLAB, ANSYS, JMP, and SolidWorks 📊💻. With strong competencies in DFM, FMEA, and packaging design, he consistently applies analytical thinking, problem-solving, and statistical methodologies to optimize microelectronic systems and hardware reliability 🔧📐📈.
🏆 Leadership
Dr. Ronit Das has demonstrated exceptional leadership and academic excellence throughout his career. He served as the President of the Surface Mount Technology Association (SMTA) at Binghamton University, where he led technical and professional development initiatives 📡🤝. He is also an esteemed member of Alpha Pi Mu, the Industrial Engineering Honor Society, reflecting his high academic standing 🎓📘. Additionally, Dr. Das was the Vice Chair for Graduate Student Services at ASQ World Headquarters, where he advocated for student engagement in quality and reliability sciences 🌍🧪. These recognitions showcase his dedication to leadership, innovation, and community building 💼⭐.
🎤 Conference Presentation
Dr. Ronit Das has actively presented his research on low-temperature solder joint reliability and interconnect durability at prestigious international conferences. His work at the Pan Pacific Microelectronics Symposium (2023) focused on optimizing solder fatigue life under varying stress conditions ⚙️🔩. At the GRC-SRC meetings (2020–2022), he showcased novel Pb-free soldering approaches to reduce warpage and enhance lifecycle performance 🧪📉. Additionally, he delivered key insights on the mechanical deformation and damage evolution of micro-joints at elevated temperatures 🔍🔥. These presentations underline his expertise in advanced packaging reliability, materials behavior, and interconnect engineering 💻🛠️📦.
🔬 Research Focus
Dr. Ronit Das focuses on advancing reliability engineering and electronic packaging technologies, particularly involving low-temperature Pb-free solder systems, intermetallic morphology, and micro-joint fatigue analysis. His research integrates experimental mechanics with materials science, using techniques such as electron microscopy, thermal cycling, and finite element modeling to investigate failure mechanisms in SnAgCu, SnBi, and hybrid solder joints. He aims to enhance the durability and performance of flip-chip, 2.5D/3D architectures, and fine-pitch interconnects under harsh operational environments. His innovations are key to improving the thermal-mechanical stability, electromigration resistance, and manufacturing efficiency of next-gen electronic systems.
📚 Publications
Comparing/Optimizing Actual Solder Fatigue Life
Author: Ronit Das
Conference: 2023 Pan Pacific Microelectronics Symposium (Jan 2023)
Early Transient Creep of Single Crystal SnAgCu Solder Joints
Authors: Ronit Das; Sanoop Thekkut; Rajesh Sharma Sivasubramony; Thaer Alghoul; Atif Mahmood; Shantanu Joshi; Carlos Arroyo; Gaurav Sharma; Peter Borgesen
Journal: Journal of Materials Science: Materials in Electronics (June 2022)
Understanding and Preventing Cu–Sn Micro Joint Defects Through Design and Process Control
Authors: Ronit Das et al.
Journal: Journal of Applied Electrochemistry (Oct 2021)
Feasibility of a Low Temperature Soldering Approach
Author: Ronit Das
Conference: TechCon – Semiconductor Research Corporation (Sept 2021)
Reliability of Micro-Joints Formed by a Low Temperature Soldering Approach
Author: Ronit Das
Conference: TechCon – Semiconductor Research Corporation (Sept 2021)
Sporadic Voiding in Cu-Sn Micro-Joints: Understanding and Control
Author: Ronit Das
Conference: TechCon – Semiconductor Research Corporation (Sept 2021)
Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures
Authors: Ronit Das; Manu Yadav; Thaer Alghoul et al.
Journal: Journal of Electronic Packaging (Sept 2021)
Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints
Author: Ronit Das
Conference: IEEE Electronic Components and Technology Conference (ECTC) (Aug 2020)