Dr Ronit Das | Metals and Alloys | Best Researcher Award

Dr. Ronit Das is a dynamic and forward-thinking materials engineer whose expertise lies in advanced microelectronics packaging, solder reliability, and interconnect technologies. With a Ph.D. in Industrial and Systems Engineering from Binghamton University (SUNY), his work bridges the gap between academic rigor and industrial application. Currently employed at Apple Inc. as an IC Package Integration Engineer, Dr. Das has previously contributed to leading tech companies like Intel, AMD, and Applied Materials. His academic and professional trajectory highlights a deep commitment to reliability science, microscale fatigue, and innovative materials for next-generation electronic systems.

Dr Ronit Das, Binghamton University, United States

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🎓 Education

Dr. Ronit Das holds a strong academic foundation in engineering and materials science. He earned his Ph.D. in Industrial and Systems Engineering from Binghamton University – SUNY (2020–2023), where his dissertation focused on Pb-free SnAgCu-Bi solder joints and their fatigue damage properties ⚙️📉. He completed his M.S. in the same field at Binghamton (2018–2019), researching intermetallic morphology and void formation in micro-joints 🔬📊. His academic journey began with a B.E. in Mechanical Engineering from the University of Mumbai (2011–2015), where he graduated with distinction 🎯📚. His education blends mechanics, reliability, and materials innovation 🧠🛠️.

🧑‍💼 Experience

Dr. Ronit Das brings a wealth of experience across academia and industry in advanced packaging, reliability engineering, and materials science. At Apple Inc. 🖥️📦, he drives innovative IC packaging from concept to high-volume manufacturing. Previously at Applied Materials 🧪🔬, he focused on failure analysis and PVD coatings. His doctoral research at Binghamton University 🎓🔧 involved solder joint fatigue, intermetallic evolution, and thermal reliability. With prior engineering roles in India 🌏⚙️, he also worked in product development and industrial safety. His expertise spans flip-chip, 2.5D/3D packaging, electromigration, and finite element modeling 🛠️📊, making him a well-rounded engineer and researcher.

🛠️ Technical Skills

Dr. Ronit Das possesses an exceptional technical portfolio in reliability testing 🧪, including fatigue, shear, vibration, and thermal cycling analysis 🔄. He is proficient in advanced failure analysis techniques such as SEM, EBSD, EDX, CT, and AFM 🔬🧠. His hands-on expertise includes thin-film deposition, non-destructive testing, and metallographic processing 🧱⚙️. He is skilled in simulation and data tools like MATLAB, ANSYS, JMP, and SolidWorks 📊💻. With strong competencies in DFM, FMEA, and packaging design, he consistently applies analytical thinking, problem-solving, and statistical methodologies to optimize microelectronic systems and hardware reliability 🔧📐📈.

🏆 Leadership

Dr. Ronit Das has demonstrated exceptional leadership and academic excellence throughout his career. He served as the President of the Surface Mount Technology Association (SMTA) at Binghamton University, where he led technical and professional development initiatives 📡🤝. He is also an esteemed member of Alpha Pi Mu, the Industrial Engineering Honor Society, reflecting his high academic standing 🎓📘. Additionally, Dr. Das was the Vice Chair for Graduate Student Services at ASQ World Headquarters, where he advocated for student engagement in quality and reliability sciences 🌍🧪. These recognitions showcase his dedication to leadership, innovation, and community building 💼⭐.

🎤 Conference Presentation

Dr. Ronit Das has actively presented his research on low-temperature solder joint reliability and interconnect durability at prestigious international conferences. His work at the Pan Pacific Microelectronics Symposium (2023) focused on optimizing solder fatigue life under varying stress conditions ⚙️🔩. At the GRC-SRC meetings (2020–2022), he showcased novel Pb-free soldering approaches to reduce warpage and enhance lifecycle performance 🧪📉. Additionally, he delivered key insights on the mechanical deformation and damage evolution of micro-joints at elevated temperatures 🔍🔥. These presentations underline his expertise in advanced packaging reliability, materials behavior, and interconnect engineering 💻🛠️📦.

🔬 Research Focus 

Dr. Ronit Das focuses on advancing reliability engineering and electronic packaging technologies, particularly involving low-temperature Pb-free solder systems, intermetallic morphology, and micro-joint fatigue analysis. His research integrates experimental mechanics with materials science, using techniques such as electron microscopy, thermal cycling, and finite element modeling to investigate failure mechanisms in SnAgCu, SnBi, and hybrid solder joints. He aims to enhance the durability and performance of flip-chip, 2.5D/3D architectures, and fine-pitch interconnects under harsh operational environments. His innovations are key to improving the thermal-mechanical stability, electromigration resistance, and manufacturing efficiency of next-gen electronic systems.

📚 Publications

Comparing/Optimizing Actual Solder Fatigue Life

Author: Ronit Das
Conference: 2023 Pan Pacific Microelectronics Symposium (Jan 2023)

Early Transient Creep of Single Crystal SnAgCu Solder Joints

Authors: Ronit Das; Sanoop Thekkut; Rajesh Sharma Sivasubramony; Thaer Alghoul; Atif Mahmood; Shantanu Joshi; Carlos Arroyo; Gaurav Sharma; Peter Borgesen
Journal: Journal of Materials Science: Materials in Electronics (June 2022)

Understanding and Preventing Cu–Sn Micro Joint Defects Through Design and Process Control

Authors: Ronit Das et al.
Journal: Journal of Applied Electrochemistry (Oct 2021)

Feasibility of a Low Temperature Soldering Approach

Author: Ronit Das
Conference: TechCon – Semiconductor Research Corporation (Sept 2021)

Reliability of Micro-Joints Formed by a Low Temperature Soldering Approach

Author: Ronit Das
Conference: TechCon – Semiconductor Research Corporation (Sept 2021)

Sporadic Voiding in Cu-Sn Micro-Joints: Understanding and Control

Author: Ronit Das
Conference: TechCon – Semiconductor Research Corporation (Sept 2021)

Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures

Authors: Ronit Das; Manu Yadav; Thaer Alghoul et al.
Journal: Journal of Electronic Packaging (Sept 2021)

Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints

Author: Ronit Das
Conference: IEEE Electronic Components and Technology Conference (ECTC) (Aug 2020)

Mr Di Feng | Metals and Alloys | Best Researcher Award

🧪 Mr. Di Feng is a promising postgraduate researcher at Hainan University, specializing in soil science and environmental microbiology 🌱🔬. His research focuses on the interaction between heavy metals and soil microbial functions, addressing critical challenges in ecosystem health and sustainable land use 🌍. As first author in top-tier journals like Journal of Hazardous Materials, he has demonstrated strong analytical skills and scientific independence 📊📝. His large-scale meta-analyses and collaborations with international scientists highlight his multidisciplinary approach and rising global impact 🤝🌐. Mr. Feng’s work contributes directly to environmental remediation and agricultural resilience 🚜♻️.

Mr Di Feng, Hainan University, China

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🎓 Education 

Mr. Di Feng reflect a strong interdisciplinary foundation bridging the humanities and environmental sciences. He earned his Bachelor of Arts from Guilin University (2019–2023) 🏫, where he developed critical thinking and research skills within the Faculty of Humanities 📚. He is currently pursuing postgraduate studies in Crop Science at Hainan University 🌱, focusing on soil ecology, nutrient cycling, and the effects of heavy metals on microbial function 🔬. This academic path illustrates his unique ability to integrate social insight with scientific rigor, preparing him for impactful research in environmental sustainability 🌍🧪.

💼 Employment 

Since September 2023, Mr. Di Feng has been serving as a postgraduate researcher at the School of Tropical Agriculture and Forestry, Hainan University, Haikou, China 🌴🎓. His role involves conducting advanced research on soil-plant-microbe interactions, with a particular focus on the ecotoxicological effects of heavy metals in tropical ecosystems 🧪🌾. As part of a dynamic academic environment, he engages in experimental design, data analysis, academic writing, and collaborative studies with national and international research teams 🌍📊. His position supports both his Ph.D. studies and broader contributions to environmental and agricultural sustainability 🌱🔍.

🔧 Skills and Expertise 

Mr. Di Feng span both scientific research and education. He possesses deep knowledge in the bioaccumulation of heavy metals 🧪⚠️, particularly their interaction with soil enzymes like urease and phosphatase 🌱🧫. His methodological expertise includes enzyme activity assays, soil-microbe interaction analysis, and ecological data synthesis 📊🔍. In addition to his environmental science credentials, Mr. Feng is also trained in English teaching methodology 📘🎓, showcasing versatility and communication skills. This unique blend of technical and pedagogical expertise positions him as both a skilled researcher and an effective scientific communicator 🌍🗣️.

🌾Research Focus

Mr. Di Feng’s research explores the impact of heavy metals on soil microbial function and enzymatic activity, a critical area in understanding soil health and nutrient cycling 🔄🧬. His work investigates how edaphic (soil) and climatic factors influence the toxicity of pollutants, offering new perspectives on microbial ecology and biogeochemical processes 🌾🦠. Through meta-analysis and experimental approaches, he evaluates the ecological consequences of pollution on key enzymes like urease and phosphatase ⚗️🌡️. His findings are vital for advancing environmental remediation, agricultural sustainability, and ecosystem resilience against anthropogenic stressors 🌍♻️🌾.

🌱 Scientific Contributions 

Mr. Di Feng’s research reveals how heavy metals/metalloids (HMMs) disrupt soil enzyme activity, essential for nutrient cycling ⚙️🧪. Through a meta-analysis of 1,989 data points from 145 studies, he quantified significant reductions in key enzymes like β-glucosidase, urease, and phosphatase (15–37% declines) 📉. His work links these reductions to lower microbial biomass and increased metabolic stress, while noting a surprising 82.2% increase in polyphenol oxidase due to microbial stress responses 🔄. He further identified that soil properties and climate mediate these effects, offering a predictive framework for HMMs’ ecological risks 🌍📊.

📚 Publications

Cadmium inhibits carbon and nitrogen cycling through soil microbial biomass and reduces soil nitrogen availability
✍️ Authors: Elrys, A.S.; Wen, Y.; Feng, D.; El-Mekkawy, R.M.; Kong, M.; Qin, X.; Lu, Q.; Dan, X.; Zhu, Q.; Tang, S. et al.
📚 Journal: Journal of Hazardous Materials, 2025

Edaphic factors mediate the response of nitrogen cycling and related enzymatic activities and functional genes to heavy metals: A review
✍️ Authors: Opande, T.; Kong, M.; Feng, D.; Wen, Y.; Okoth, N.; Yatoo, A.M.; Khalil, F.M.A.; Elrys, A.S.; Meng, L.; Zhang, J.
📚 Journal: Ecotoxicology and Environmental Safety, 2025

Synergistic effects of clove fruit extract and nano-silicon to enhance drought resilience and productivity of soybean through improved plant defense mechanisms
✍️ Authors: Desoky, E.-S.M.; Mahmood, M.; Feng, D.; Ahmed, A.F.; Al Masoudi, L.M.; Alahmari, A.S.; Eid, R.S.M.; Rady, M.M.; Ayyoub, A.; Taha, N.A.
📚 Journal: BMC Plant Biology, 2025

Edaphic and climatic factors control the response of nutrient-cycling enzyme activity to common heavy metals in soils
✍️ Authors: Di Feng; Lei Meng; YuHong Wen; Yves Uwiragiye; Synan AbuQamar; Nathan Okoth; Qilin Zhu; Zhipeng Wu; Yanzheng Wu; Christoph Müller et al.
📚 Journal: Journal of Hazardous Materials, 2025

Co-application of organic amendments and natural biostimulants on plants enhances wheat production and defense system under salt-alkali stress
✍️ Authors: Zaghloul, E.A.M.; Awad, E.-S.A.; Mohamed, I.R.; El-Hameed, A.M.A.; Feng, D.; Desoky, E.-S.M.; Algopishi, U.B.; Al Masoudi, L.M.; Elrys, A.S.; Mathew, B.T. et al.
📚 Journal: Scientific Reports, 2024